发明名称 Capacitive substrate and method of making same
摘要 A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and the second glass layer positioned over the second conductor. Conductive thru-holes are formed to couple to the first and second conductors, respectively, such that the conductors and capacitive dielectric material form a capacitor when the capacitive substrate is in operation.
申请公布号 US7803688(B2) 申请公布日期 2010.09.28
申请号 US20090380616 申请日期 2009.03.02
申请人 ENDICOTT INTERCONNECT TECHNOLOGIES, INC. 发明人 DAS RABINDRA N.;EGITTO FRANK D.;LAUFFER JOHN M.;LIN HOW T.;MARKOVICH VOYA R.
分类号 H01L21/20 主分类号 H01L21/20
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