| 摘要 |
PROBLEM TO BE SOLVED: To prevent treatment liquid in a treatment liquid supply nozzle from drying when supplying treatment liquid from the treatment liquid supply nozzle to a substrate such as a semiconductor wafer. SOLUTION: An air layer and the solvent layer of a treatment liquid are formed outside the treatment liquid layer inside the tip of treatment liquid supply nozzles 4A to 4J of a nozzle unit 4. Next, the solvent layer of the treatment liquid supply nozzle 4A is discharged into the liquid discharge section of a standby unit 6. Then, the treatment liquid is supplied from the nozzle 4A to the surface of a wafer W and coating treatment is performed. Thereafter, the air layer and the solvent layer are formed outside the treatment liquid layer inside the tip of treatment nozzles 4A by sucking the remaining treatment liquid in the nozzle 4A, immersing the tip of each nozzle 4A to 4J of the nozzle unit 4 into inside of the solvent at the solvent storage section of the standby unit 6, and sucking the nozzle 4A. COPYRIGHT: (C)2010,JPO&INPIT |
