摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor light receiving element, which gives a cured article efficiently shielding a short wavelength region of visible light and having good optical transparency in a longer wavelength region; and to provide a process for producing the same. SOLUTION: An epoxy resin composition for sealing an optical semiconductor light receiving element includes an epoxy resin, a hardener, and a hardening promotor, as well as a yellow dye. An epoxy resin composition for sealing an optical semiconductor light receiving element contains≥0.01 wt.% of the yellow dye based on the entire epoxy resin composition. COPYRIGHT: (C)2010,JPO&INPIT |