发明名称 EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR LIGHT RECEIVING ELEMENT, PROCESS FOR PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor light receiving element, which gives a cured article efficiently shielding a short wavelength region of visible light and having good optical transparency in a longer wavelength region; and to provide a process for producing the same. SOLUTION: An epoxy resin composition for sealing an optical semiconductor light receiving element includes an epoxy resin, a hardener, and a hardening promotor, as well as a yellow dye. An epoxy resin composition for sealing an optical semiconductor light receiving element contains≥0.01 wt.% of the yellow dye based on the entire epoxy resin composition. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010209181(A) 申请公布日期 2010.09.24
申请号 JP20090055391 申请日期 2009.03.09
申请人 NITTO DENKO CORP 发明人 FUKUYA KAZUHIRO
分类号 C08L63/00;C08J3/22;H01L23/29;H01L23/31 主分类号 C08L63/00
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