| 摘要 |
A semiconductor device with a design which prevents entry of cutting fluid and debris when dicing to form single pieces, and thereby improves reliability. The semiconductor device is provided with a substrate (6); at least one semiconductor chip (2) having a piezoelectric conversion function, mounted on a main surface of the substrate (6); a case (1) which is fixed to the main surface of the substrate (6) and covers the semiconductor chip; a through hole which is formed in either the substrate (6) or the case (1); and predetermined substance which is filled in the through hole and closes the through hole. The predetermined substance has a characteristic in which the substance becomes wet and spreads when heated and opens the through hole. |
