COPPER FOIL WITH RESIN AND PROCESS FOR PRODUCING COPPER FOIL WITH RESIN

摘要

Disclosed is a copper foil with a resin that can realize an improvement in dimensional stability of a build-up printed wiring board and can realize the formation of a fine pitch circuit. Also disclosed is a process for producing the copper foil with a resin. The copper foil with a resin comprises a copper foil, and a cured resin layer and a semi-cured resin layer provided in that order on a surface of the copper foil. The surface roughness (Rzjis) of a side, of the copper foil, in contact with the cured resin layer is 0.5 mu m to 2.5 mu m. The cured resin layer comprises any resin component selected from polyimide and polyamide-imide resins having a coefficient of thermal expansion of 0 ppm/ DEG C to 25 ppm/ DEG C or composite resins of the polyimide resins and the polyamide-imide resins. The semi-cured resin layer is provided on the cured resin layer and has a coefficient of thermal expansion of 0 ppm/ DEG C to 50 ppm/ DEG C after curing.