JUNCTION-GLASS CUTTING METHOD, PACKAGE MANUFACTURING METHOD, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED WATCH

摘要

Provided is a junction-glass cutting method for cutting a junction glass, in which a plurality of glass substrates are junctioned on their junction faces through a junction material, along a cut-scheduled line. The junction glass cutting method is characterized by comprising a first laser irradiating step of emitting a first laser to irradiate a beam of the absorption band wavelength of the junction material, along the cut-scheduled line, thereby to separate the junction material on the cut-scheduled line from the junction faces, a second laser irradiating step of emitting a second laser to irradiate a beam of the absorption band wavelength of the junction material, along the cut-scheduled line, thereby to form a groove in one face of the junction glass, and a cutting step of cutting the junction glass along the cut-scheduled line by applying a splitting stress to the cut-scheduled line of the junction glass.