| 摘要 |
The invention is to provide a circuit module with miniaturization realizable COB structure. The invention provides a method for manufacturing a circuit module with COB structure of installing an electronic component including naked chip and a terminal for external connection connected to the electronic component on a substrate and sealing the electronic component with sealing agent, the method is characterized by comprising steps of: installing the electronic component and the terminal for external connection on the substrate; sealing the electronic component and the terminal for external connection with the sealing agent; and exposing the terminal for external connection. |
