ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: An electronic device package and a method of manufacturing thereof are provided to prevent the inflow of foreign material into a protective area of the electronic device. CONSTITUTION: An electronics device package comprises a substrate assembly(200), an electronic device, and a sealing ring(400). The electronic device is faced with a substrate assembly. The sealing ring is arranged between the substrate assembly and the electronic device and form a sealing layer(410) and a bonding layer(420). The sealing ring is formed as a closed loop surrounding the sealing area of the electronic device.