| 摘要 |
PURPOSE: The emitting device prevents the diffusion of the solder bonding the material world to the reflecting layer or the epi layer. The brittle and adhesive property are improved. CONSTITUTION: The solder bonding layer(9) is formed on the conductive board(10). The diffusion stopper(8) is formed on the solder bonding layer. The bonding layer(7) is formed on the diffusion stopper. The ohmic contact layer(6) is formed on the bonding layer. The radiation semiconductor layer(5) is formed on the ohmic contact layer. The ohmic contact layer comprises the insulating layer or the impurity injecting layer.
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