发明名称 ADHESION TEST METHOD USING ELASTIC PLATE
摘要 Provided is a method for testing adhesion. The method includes forming thin films on a substrate; attaching an elastic plate to the substrate, wherein the elastic plate has a larger elastic coefficient than the substrate; and performing an adhesion test on the thin films using an adhesion test apparatus.
申请公布号 US2010206062(A1) 申请公布日期 2010.08.19
申请号 US20100704960 申请日期 2010.02.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YOON YEO-HOON;MOON HO-JEONG
分类号 G01N19/04 主分类号 G01N19/04
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