| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device with improved practical luminance and light extraction efficiency; and to provide a wiring substrate for light-emitting chip mounting, applied to the semiconductor light-emitting device. <P>SOLUTION: The semiconductor light-emitting device 1 includes an insulating substrate 10 on which a semiconductor light-emitting element chip 2 has been mounted, and further includes, on a surface 10s of the insulating substrate 10, a chip arrangement region Ac where the semiconductor light-emitting element chip 2 has been arranged and an outer peripheral region Af enclosing the chip arrangement region Ac, and also includes a first resin film 21 laminated and formed on the outer peripheral region Af and containing dispersed rutile type titanium oxide particulates. <P>COPYRIGHT: (C)2010,JPO&INPIT |
