Pressure transducers employing radiation hardened electronics

摘要

There is disclosed a transducer employing radiation hardened electronics. Essentially a sensor assembly is positioned in a front section of a housing where the sensor assembly is coupled to an electronic module via terminals which connect the sensor to the module. The electronic module assembly is surrounded by an internal tungsten housing which is formed from a first tungsten“U”shaped cross-sectional member coupled to a second tungsten“U”shaped cross-sectional enclosure. The two members are coupled together and totally surround the electronic assembly. The members as held together are positioned within the housing by outer shell members to form a complete housing assembly whereby the electronic assembly and its associated terminal pins are totally surrounded by the tungsten holder section and the tungsten enclosure section.