| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small high frequency module which removes high frequency transmission loss and unnecessary radiation, and has successful heat dissipation. Ž<P>SOLUTION: The high frequency module is provided with: a semiconductor 1; a multi-layered substrate 2 on which the semiconductor 1 is loaded; a metal frame 3 installed on the multi-layered substrate 2; a lid 4 provided at an upper part of the metal frame 3; a metal carrier 5 provided with an opening so that a part of the multi-layered substrate 2 is exposed; a first base plate 6 which fixes the metal carrier 5 on one surface and has a first opened waveguide terminal 6a provided opposite to the opening; a second base plate 7 one surface of which is fixed by being overlapped with the other surface of the first base plate 6, and has a second waveguide terminal 7b opened at a position separated from a position opposite to the first waveguide terminal 6a on the other surface; and a substrate 8 to which power is supplied via the second waveguide terminal 7b, and on which an antenna pattern 8a installed by being overlapped with the other surface of the second base plate 7 is formed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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