发明名称 SOCKET FOR CONNECTING BALL-GRID-ARRAY INTEGRATED CIRCUIT DEVICE TO TEST CIRCUIT
摘要 A simple structure socket 10 for connecting a ball grid array integrated circuit device to a test circuit has a base 14, contacts 26 arranged corresponding to the ball grid array, a nest assembly 16 of two comb structures 70 and a lever assembly 18 for spacing opposed tip portions of each contact away from each other to define a gap for receiving a ball. The lever assembly has two rectangular frames 86 each made of a distal cross piece 94, a proximal cross piece and two side pieces connecting the distal and proximal cross pieces. The two rectangular frames are arranged so that the side pieces are intersected at substantially mid portions thereof. This allows that, by depressing the proximal cross pieces toward the base, the distal cross pieces forces the comb structures toward each other.
申请公布号 US2010197152(A1) 申请公布日期 2010.08.05
申请号 US20100756205 申请日期 2010.04.08
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 NAITO MASAHITO;NAGUMO TAKAYUKI
分类号 H01R33/76;G01R1/04;H01R12/71;H01R13/193 主分类号 H01R33/76
代理机构 代理人
主权项
地址