TEST PATTERN OF THE SEMICONDUCTOR DEVICE AND MEASURING THE THICKNESS OF FUSE USING THE SAME

摘要

PURPOSE: A test pattern of a semiconductor device and a method for measuring the thickness of a fuse using the same are provided to improve the accuracy of fuse blowing by measuring the thickness of a fuse pattern. CONSTITUTION: A test pattern(110) of a semiconductor device comprises a first pattern and a second pattern. The first pattern comprises the same form as a fuse pattern(105). A second pattern is arranged in zigzag pattern to connect the first patterns. The first pattern and the second pattern are etched identically with the fuse pattern. The first pattern is a line pattern. A plurality of first patterns is formed. A pad pattern(120) is formed on the center and both ends of the test pattern.