摘要 |
An arrangement of an electronic component in a plastic housing, including a cover and a lower part, and to a method for fixing the electronic component in the housing. The cover is connected to the lower part and exerts a pre-defined force (F) on the electronic component. The cover is designed such that the influence of the height tolerance (dh) of the electronic component on the force (F) can be compensated to the effect that, once the cover has been mounted, the force (F) applied to the lower part is in a pre-defined force range (B).
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