发明名称 Method of making nitride semiconductor laser, method of making epitaxial wafer, and nitride semiconductor laser
摘要 <p>A method of making a nitride semiconductor laser comprises forming a first InGaN film for an active layer on a gallium nitride based semiconductor region, and the first InGaN film has a first thickness. In the formation of the first InCraN film, a first gallium raw material, a first indium raw material, and a first nitrogen raw material are supplied to a reactor to deposit a first InCraN for forming the first InGaN film at a first temperature, and the first InGaN has a thickness thinner than the first thickness. Next, the first InGaN is heat-treated at a second temperature lower than the first temperature in the reactor, while supplying a second indium raw material and a second nitrogen raw material to the reactor. Then, after the heat treatment, a second InGaN is deposited at least once to form the first InCiraN film. </p>
申请公布号 EP2112729(A3) 申请公布日期 2010.07.21
申请号 EP20090158600 申请日期 2009.04.23
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 UENO, MASAKI;KYONO, TAKASHI
分类号 H01S5/343;H01L21/20;H01L33/00 主分类号 H01S5/343
代理机构 代理人
主权项
地址