发明名称 Exposure apparatus and exposing method and method of manufacturing a printed wiring board
摘要 The mask-less exposure apparatus includes: a stage which moves with the substrate having a photosensitive resin layer with sensitivity to ultraviolet radiation formed thereon; a first light source for emitting light containing a wavelength component in the wavelength range of 300 to 410 nm; a first light irradiation optical system for modulating a radiant flux emitted from the first light source based on data of a desired exposure pattern to image a pattern on the photosensitive resin layer; a second light source for emitting light containing a wavelength component in the wavelength range of 450 to 2500 nm; and a second light irradiation optical system for guiding a radiant flux emitted from the second light source to a second light irradiation area that is set so as to include at least a first light irradiation area.
申请公布号 US7760328(B2) 申请公布日期 2010.07.20
申请号 US20060370044 申请日期 2006.03.08
申请人 HITACHI VIA MECHANICS, LTD. 发明人 YAMAGUCHI YOSHIHIDE;OYAMA HIROSHI
分类号 G03B27/72 主分类号 G03B27/72
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