| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an atomic layer deposition apparatus capable of loading/unloading a plurality of substrates at once. <P>SOLUTION: The atomic layer deposition apparatus, capable of loading/unloading a plurality of substrates when the plurality of substrates are moved to a process module, includes a loading/unloading module 10, loading and unloading the substrates, and a plurality of process chambers 31 where the plurality of substrates are housed at once and a deposition process is executed. The apparatus further includes: a process module 30 provided with a gas injection unit which is so provided with an exhaust part as to intake an exhaust gas in the process chamber to discharge to the upper part of the process chamber; and a transfer module 20 including a transfer robot which is provided between the loading/unloading unit and the process module to transfer the substrates, at this time, the plurality of substrates are purged at once and transferred. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
