| 摘要 |
A circuit substrate for improving the reliability and productivity of a semiconductor device, and that semiconductor device. In a circuit substrate to which a semiconductor element is to be flip-chip mounted, at least one island-shaped electrically conductive layer is selectively disposed together with a wiring layer at an element mounting area where the semiconductor element is to be mounted, and an insulating resin layer is disposed over the island-shaped electrically conductive layer. The semiconductor element is secured at the element mounting area to the circuit substrate by an adhesion material to make a semiconductor device. With this, delaminating of the wiring layer inside the semiconductor device is suppressed, and the damage of an electrode is suppressed. The circuit substrate has high reliability and the semiconductor device, having the circuit substrate, is implemented.
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