| 摘要 |
The object is to provide an integrated compressor that enables a control board to be miniaturized while ensuring a layout in which the heat radiation of parts is considered. Diodes 43 and IGBTs 42 that correspond to each of the U-phase, V-phase and W-phase are arrayed in series for each phase. Rectangular chips are used for the diodes 43 and IGBTs 42. As a result of this, a power board 16 is substantially miniaturized, and the diode 43, the IGBT 42, a P-terminal electrode pattern 40, an N-terminal electrode pattern 41, a shunt resistor 44, output terminal patterns 48U, 48V, 48W, and a feed pattern 50 are disposed so as to lie in a region in contact with an outer surface of a housing.
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