| 摘要 |
An electronic component is provided to improve the junction characteristic of soldering or wire bonding by forming a connection terminal or a mounting terminal in an electronic component by a coating layer in which germanium is added to a palladium coating layer. An electronic component includes a chip, a chip mounting part and a base material. A connection terminal is included in the chip. A corresponding chip is mounted on the chip mounting part by using the connection terminal. The base material has a mounting terminal to be mounted on a substrate. A palladium coating layer including germanium is formed on at least one of the connection terminal of the chip, the chip mounting part of the base material, and the mounting terminal. The electronic component can be a package made of one of a leadframe, a glass substrate or a ceramic substrate. |
