| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily and efficiently form a conical bump on a substrate by suppressing excessive rise of substrate temperature regardless of bump size. Ž<P>SOLUTION: This device for forming a minute metal bump includes a substrate holding means 1 to hold a substrate 10 where a hole pattern for exposing predetermined parts of metal wiring formed on one surface side is formed on a mask layer covering the metal wiring, and a metal fine particle spray means to spray metal fine particles obtained by evaporating metal along with a carrier gas from a nozzle 62 to the one surface side of the substrate 10 held by the substrate holding means 1, and is structured to deposit the metal fine particles sprayed by the metal fine particle spray means on the predetermined parts of the metal wiring to form conical metal bumps by a gas deposition method. The substrate holding means 1 includes a cooling member 2 for holding the substrate 10 from the other surface side thereof, and a thermally-conductive sheet 4 interposed between the substrate 10 and the cooling member 2 and having flexibility. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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