| 发明名称 |
THERMAL INTERFACE MATERIAL, ELECTRONIC DEVICE CONTAINING THE THERMAL INTERFACE MATERIAL, AND METHODS FOR THEIR PREPARATION AND USE |
| 摘要 |
<p>A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIMl and TIM2 applications in electronic devices.</p> |
| 申请公布号 |
KR20100069667(A) |
申请公布日期 |
2010.06.24 |
| 申请号 |
KR20107007429 |
申请日期 |
2008.09.05 |
| 申请人 |
DOW CORNING CORPORATION |
发明人 |
BHAGWAGAR DORAB EDUL;LILES DONALD;SHEPHARD NICK EVAN;XU SHENGQING;LIN ZUCHEN;ELAHEE G.M. FAZLEY |
| 分类号 |
H01L23/373;H01L23/36 |
主分类号 |
H01L23/373 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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