SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to easily emit the heat from a semiconductor package by attaching a radiant heat pad to the exposed upper side of the semiconductor die. CONSTITUTION: A substrate(110) includes a land(111) formed on the lower side of the substrate and a conductive pattern(112) connected with the land. A semiconductor die(120) is formed on the upper side of the substrate. A conductive bump(130) electrically connects the conductive pattern of the substrate and a bond pad of the semiconductor die. An encapsulation(140) is formed to cover the semiconductor die and the conductive bump. The encapsulation includes an internal cavity(140a).