Ultrasound transducer and method for implementing flip-chip two dimensional array technology to curved arrays

摘要

An ultrasound transducer probe (40) includes a support substrate (54), an integrated circuit (42) and an array of piezoelectric elements (50). The support substrate (54) has a non-linear surface (55). The integrated circuit (42) physically couples to the support substrate (54) overlying the non-linear surface (55), wherein the integrated circuit (42) substantially conforms to a shape of the non-linear surface (55). An array of piezoelectric elements (50) couples to the integrated circuit (42).