发明名称 RESINOUS BONDED ARTICLE AND METHOD FOR PRODUCING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a resinous bonded article in which a liquid sample leaking from a liquid flow passage is not stuck to the side faces of first and second resin members and an adhesive or a solvent is not contacted with the bonded surface of the first resin member to the second resin member or a liquid flow passage-formed groove, and to provide a method for producing the resinous bonded article. <P>SOLUTION: When the first resin member 2 is bonded to the second resin member 3 to form the resinous bonded article 1, the surfaces 20, 30 to be bonded are thermally bonded to each other in a thermal bonding step and the edge portions 213, 214 of the bonded surface 20 are bonded by using the solvent to the edge portions 313, 314 of the bonded surface 30 of the second resin member 3 in a solvent bonding step. When the solvent bonding is carried out, the solvent is supplied to a grooved opening 16 formed by the chamfered parts 213a, 313a and another grooved opening 17 formed by the chamfered parts 214a, 314a. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010131963(A) 申请公布日期 2010.06.17
申请号 JP20090103070 申请日期 2009.04.21
申请人 NIDEC SANKYO CORP 发明人 KOBAYASHI KAZUO
分类号 B29C65/48;B29C65/02;B29K33/00;G01N37/00 主分类号 B29C65/48
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