发明名称 HEAT TREATMENT APPARATUS
摘要 PURPOSE: A heat processing device is provided to prevent impurities included in discharged gas from being attached to the inner wall of a discharging pipe path by heating the gas provided from a gas supplier based on a detection signal from a temperature detection sensor. CONSTITUTION: A heat plate(65) heats a processed substrate at a predetermined temperature. An exhaust pipe(66) is arranged on the upper side of a processing chamber and exhausts the gas inside the process chamber. An exhaust pipe path(67) is connected to the exhaust pipe. A gas supply unit(70) is installed in the exhaust pipe path. A control unit(75) controls the gas supply unit.
申请公布号 KR20100066399(A) 申请公布日期 2010.06.17
申请号 KR20090121116 申请日期 2009.12.08
申请人 TOKYO ELECTRON LIMITED 发明人 SHINYA HIROSHI
分类号 H01L21/324 主分类号 H01L21/324
代理机构 代理人
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