发明名称 RESIN MOLDED PRODUCT WITH HIGH LIGHT RESISTANCE AND HIGH THERMAL CONDUCTIVITY AND LIGHTING FIXTURE COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a lightweight resin molded product excellent in high thermal conductivity, electric insulation, injection moldability, etc., and having high light resistance; and especially a substrate for LED mounting and a reflector disposed on the substrate for mounting, improving heat dissipation performance while exhibiting optical performance and not damaging merchantability. SOLUTION: The resin molded product with a degree of whiteness of 80 or more is obtained from a resin composition containing at least a thermoplastic polyester-based resin (A) and scale-shaped hexagonal boron nitride powders (B), the (B) having a number-average particle diameter of 15 &mu;m or more, a degree of whiteness of 90 or more, and a graphitization index of 2.0 or less, and a volume ratio (A)/(B) being 85/15 to 25/75. In the molded product, a color difference &Delta;E between before and after irradiation is 10 or less when continuously irradiated with a 400W mercury-vapor lamp for 7 days from 10 cm distance in 120&deg;C atmosphere, heat conductivity as the molded product is 2W/m&times;K or more, and a thermal deformation temperature is 150&deg;C or higher, and further a surface electric resistance value is 10<SP>11</SP>&Omega; or more. COPYRIGHT: (C)2010,JPO&amp;INPIT
申请公布号 JP2010121102(A) 申请公布日期 2010.06.03
申请号 JP20090031682 申请日期 2009.02.13
申请人 KANEKA CORP 发明人 NOGUCHI KISABURO;MATSUMOTO KAZUAKI
分类号 C08J5/00;C08K7/00;C08L67/00;F21V7/22 主分类号 C08J5/00
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