| 摘要 |
<p>A surface-acoustic-wave device which does not need a complicated processing step, which does not need preparation of a component such as a cover member having a complicated shape, which is inexpensive, and which is capable of increasing miniaturization, and a method for manufacturing the surface-acoustic-wave device are provided. A method for manufacturing a surface-acoustic-wave-filter device (1) includes a step of forming grooves (2b and 2c) in one principal surface (2a) of a piezoelectric substrate (2), a step of embedding a metallic film in the grooves (2b) to form IDT electrodes, a step of performing a process of removing a portion of the piezoelectric substrate (2) from the one principal surface (2a) of the piezoelectric substrate (2), thereby forming a recessed portion (2d) having the bottom surface in which the IDT electrodes are embedded, and a step of bonding a cover member (13) to the piezoelectric substrate (2).</p> |
