| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which removal of adhesion material residue after a surface protection tape is peeled is not required. <P>SOLUTION: The semiconductor device is provided with a package 21 having a base 21A and a frame 21B arranged at a peripheral edge of the base 21A, a semiconductor chip 11 loaded on the base 21A, a translucent member 16 bonded to the semiconductor chip 11, sealing resin 31 with which the frame 21 is filled so that it surrounds the translucent member 16, and the protection tape 41 fixed by an adhesion material 42 so that it covers the upper faces of the translucent member 16 and sealing resin 31. The adhesion material 42 is installed except for a part covering an upper face of the translucent member 16 in the protection tape 41. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
