| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board which is highly reliable by suppressing heat generation caused by the concentration of electric current at bonding portions between a metal post and metal circuit plates, wherein the metal post arranged in a through-hole of a ceramic substrate connect between metal circuit plates on upper and lower surfaces of the ceramic substrate. SOLUTION: The ceramic circuit board includes: metal circuit plates 3; a ceramic substrate 1 which includes a through-hole 4 and to both the surface of which the metal circuit plates 3 are bonded via first brazing materials 2; and a metal post 5 which is placed in the through-hole 4 of the ceramic substrate 1 and to which the metal circuit plates 3 are bonded via second brazing materials 6; wherein the second brazing materials 6 respectively spread from the ends of the metal post 5 to the metal circuit plates 3, to form menisci. The electric current smoothly flows through the menisci formed in the brazing materials 6. It is hard that the electric current concentrates in the bonded part between the metal post 5 and the metal circuit plate 3 by the brazing material 6, so that local heat generation is reduced. Therefore, the ceramic circuit board works for a long term normally and stably. COPYRIGHT: (C)2010,JPO&INPIT |
