| 发明名称 |
SUBSTRATE WITH CHIPS MOUNTED THEREON, METHOD OF MANUFACTURING SUBSTRATE WITH CHIPS MOUNTED THEREON, DISPLAY, AND METHOD OF MANUFACTURING DISPLAY |
| 摘要 |
Disclosed herein is a substrate with chip mounted thereon, including: a solder pattern having a plan-view shape in which projected parts are projected radially from a central part; and a chip fixed in the state of being aligned to the central part of the solder pattern. |
| 申请公布号 |
US2010123163(A1) |
申请公布日期 |
2010.05.20 |
| 申请号 |
US20090622639 |
申请日期 |
2009.11.20 |
| 申请人 |
SONY CORPORATION |
发明人 |
OHTORII HIIZU;AOYAGI AKIYOSHI;TOMODA KATSUHIRO |
| 分类号 |
H01L33/00;H01L21/50;H01L21/60 |
主分类号 |
H01L33/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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