发明名称 ADJUSTING POLISHING RATES BY USING SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING
摘要 A computer implemented method includes receiving a sequence of current spectra of reflected light from a substrate; comparing each current spectrum from the sequence of current spectra to a plurality of reference spectra from a reference spectra library to generate a sequence of best match reference spectra; determining a goodness of fit for the sequence of best match reference spectra; and determining at least one of whether to adjust a polishing rate or an adjustment for the polishing rate, based on the goodness of fit.
申请公布号 WO2010028180(A3) 申请公布日期 2010.05.20
申请号 WO2009US55935 申请日期 2009.09.03
申请人 APPLIED MATERIALS, INC.;DAVID, JEFFREY DRUE;BENVEGNU, DOMINIC J.;LEE, HARRY Q.;SWEDEK, BOGUSLAW A. 发明人 DAVID, JEFFREY DRUE;BENVEGNU, DOMINIC J.;LEE, HARRY Q.;SWEDEK, BOGUSLAW A.
分类号 H01L21/304 主分类号 H01L21/304
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