CIRCUIT BOARD MANUFACTURING METHOD

摘要

There is provided a thin circuit substrate and circuit module that include a protruding terminal, and a method for manufacturing the circuit substrate.
A circuit module (60) includes an IC (50) mounted on a circuit substrate (10). IC (50) includes an IC body (52) and an solder bump (54) formed on a mounting surface of the IC body (52). The circuit substrate (10) includes a substrate (12) having a recess (15) formed by recessing part of a mounting surface of the substrate on which the IC (50) is to be mounted, and a terminal (14) protruding from the mounting surface of the substrate (12). The terminal (14) is to be electrically connected to the solder bump (54).