| 摘要 |
PURPOSE: An adhesive layer forming solution and a formation method of an adhesive layer are provided to maintain a formation efficiency of the adhesive layer, and to secure the adhesion force with a resin. CONSTITUTION: An adhesive layer forming solution for attaching copper with a resin is an aqueous solution containing acid, first stannous salt, second stannous salt, a complexing agent and a stabilizer. The formation method of the adhesive layer for attaching the copper with the resin comprises a step of treating the surface of the copper with the adhesive layer forming solution.
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