| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent cogging of a grind stone while planarizing the surface of an insulating resin layer on which an electroless plating film is formed, and to form an electroless plating film with good adhesive properties. Ž<P>SOLUTION: An insulating resin layer 12 is formed by dispersing fillers 10 in a base resin 11, wherein each filler contains a resin 10a that contains at least one of an unsaturated carbon bond, a carbonyl group, and an alkoxy group (or contains an unsaturated carbon bond and at least one of a cyano group and an aryl group) and ceramics 10b in a single particle; a hydroxyl group, a carbonyl group, or a carboxyl group is generated as a functional group by oxidizing the resin 10a that is exposed on the surface of the insulating resin layer 12 by means of grinding; and an electroless plating film is deposited on the insulating resin layer 12 via a silane coupling agent and a metal catalyst by coupling the silane coupling agent to the functional group. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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