Method for manufacturing piezoelectric device

摘要

A lower electrode (20) and an adhesive layer (30A) composed of an insulator are formed on a back face on the ion implantation layer side of a piezoelectric single crystal substrate (1). A supporting substrate (30B) in which sacrificial layers (40) composed of a conductive material have been formed is bonded to the surface of the adhesive layer (30A). By heating the composite body including the piezoelectric single crystal substrate (1), the lower electrode (20), the adhesive layer (30A), and the supporting substrate (30B), a layer of the piezoelectric single crystal substrate is detached to form a piezoelectric thin film (10). A liquid polarizing upper electrode (50) is formed on a detaching interface (13) (the face further from the sacrificial layers) of the piezoelectric thin film (10). A pulsed electric field is applied using the polarizing upper electrode (50) and the sacrificial layers (40) as counter electrodes. Consequently, the piezoelectric thin film (10) is polarized.