| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin and compact optical semiconductor device having excellent mechanical strength and humidity resistance. <P>SOLUTION: In the optical semiconductor device 10A, an optical semiconductor element 14, which includes a light reception section or a light emission section, is sealed by an encapsulating resin. The optical semiconductor device includes a coating layer 12 that covers the surface of the optical semiconductor element and is made of a material transparent to light that enters the optical semiconductor element or is emitted from the optical semiconductor element. A filler is mixed into the encapsulating resin. The sealing resin corresponding to an upper surface of the coating layer includes a recess, and the coating layer is exposed from the encapsulating resin. <P>COPYRIGHT: (C)2010,JPO&INPIT |
