METHOD OF MOUNTING A FLIP CHIP ON A SUBSTRATE

摘要

METHOD FOR MOUNTING A FLLP CHIP ON A SUBSTRATE ABSTRACT THE INVENTION CONCERNS A METHOD FOR MOUNTINP A SEMICONDUCTOR CHIP (2) WITH BUMPS (I) ON ONE SURFACE ONTO A SUBSTRATE LOCATION (3) OF A SUBSTRATE (4), WHEREBY THE BUMPS (1) ARE BROUGHT INTO CONTACT WAH 5 CORRESPONDING PADS (IO) ON THE SUBSTRATE LOCATION (3). REFERENCE MARKS (I-2, 13) ARE ATTACHED TO THE BONDHEAD (6) THAT ENABLE MEASUREMENT OF THEACTUAL POSITION OF THE SEMICONDUCTOR CHIP (121) AS WELL AS MEASUREMENT OF THE ACTUAL POSITION OF THE SUBSTRATE LOCATION (J) IN RELATION TO A SVSTERN OF COORDINATES DEFINED BY THE REFERENCE MARKS (12, 1 3). POSITIONAL DISPLACEMENT OF THE INDIVIDUAL COMPONENTS OFTHE ASSEMBLY MACHINE CAUSED BY THER-MAL INFLUENCES CAN BE COMPENSATED WITHOUT PERPETUAL CALIBRATION 0 PROCEDURES HAVING TO BE CARFIED OUT.