APPARATUS FOR PROCESSING SUBSTRATE

摘要

PURPOSE: An apparatus for processing a semiconductor substrate is provided to prevent an empty space and a gap by improving the adhesion and density of a thin film formed on the semiconductor substrate. CONSTITUTION: A semiconductor substrate is processed in a chamber. A holder(110) is prepared inside the camber and holds the semiconductor substrate. A transfer unit is installed inside the chamber and transfers the holder A heat supply unit(200) supplies heat to the semiconductor substrate along the holder transferred by the transfer unit.