发明名称 |
WHITE LIGHT EMITTING DIODE PACKAGE |
摘要 |
<p>PURPOSE: A white light emitting diode package is provided to combine blue, red light emitting diode chips with a phosphor by controlling the ratio of voltage applied to the array of light emitting cell in a blue light emitting diode or blue and red light emitting diode chips. CONSTITUTION: A blue light emitting diode chip(30b) includes a first array of a plurality of light emitting cells(31c) serially connected on a single substrate. A plurality of red light emitting diode chips(20r) is serially connected to the first array. A yellow phosphor changes the wavelength of light emitted from the blue light emitting diode chip. The voltage applied to the blue light emitting diode chip is within 50 - 90 % of the total voltage applied to the package. The voltage applied to red light emitting diode chips is within 10 - 30 % of the total voltage applied to the package. The voltage applied to the blue light emitting diode and red light emitting diode chips implement white light of 2500 - 4000 K.</p> |
申请公布号 |
KR20100038252(A) |
申请公布日期 |
2010.04.14 |
申请号 |
KR20080095925 |
申请日期 |
2008.09.30 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
JUNG, JUNG HWA;PARK, IN KYU;CHOI, BYUNG HOON |
分类号 |
H01L33/48;H01L33/50;H01L33/62 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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