| 摘要 |
<p>A polishing liquid containing a colloidal silica having an average particle diameter of not less than 40 nm, water and a ? potential adjusting component. The polishing liquid is characterize in that (1) the ? potential adjusting component is composed of at least one sodium salt selected from the group consisting of sodium nitrate and sodium sulfate, and the polishing liquid has a pH of not less than 8, or alternatively (2) the ? potential adjusting component is composed of at least one water-soluble organic polymer selected from the group consisting of water-soluble polyether polyamines and water-soluble polyalkylene polyamines and at least one acid selected from the group consisting of hydrochloric acid, sulfuric acid, nitric acid, nitrous acid, sulfurous acid and amidosulfuric acid, with the molar ratio of the acid to the water-soluble organic polymer being 0.6-1.4, and the polishing liquid has a pH of not less than 8.</p> |
