| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed-wiring board capable of reliably and electrically connecting substrate sheets having a conductive bump sandwiching a nonconductive sheet while the conductive bump reliably penetrates the nonconductive sheet. <P>SOLUTION: While the substrate sheet 10 is placed on a flat member 20, the conductive bump 14 is formed at each projection 12 on the surface of the substrate sheet 10 to generate the substrate sheet 10 having the conductive bump 14. Then, while the substrate sheet 10 having the conductive bump 14 is placed on the flat member 20, the nonconductive sheet 40 is placed on the substrate sheet 10 having the conductive bump 14, and the conductive bump 14 passes through the nonconductive sheet 40 by clamping a combination body of the nonconductive sheet 40, the substrate sheet 10 having the conductive bump 14, and the flat member 20. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
