发明名称 SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To prevent deformation of electrical substrate to improve packaging accuracy of electrical component. SOLUTION: A plurality of rigid-flexible substrates, a frame member 600 for holding the rigid-flexible substrates, and holding members 100c-e, 200c-e, 300c-e which connect the frame member 600 and rigid-flexible substrates to make the frame member 600 hold the rigid-flexible substrate are equipped. Each rigid-flexible substrate is formed into an approximately rectangular plate form and includes a plurality of non-flexible rigid substrates and a plurality of flexible substrates having plasticity and flexibility and connecting each of the plurality of rigid substrates. The holding members 100c-e, 200c-e, 300c-e hold each rigid substrate. At least 3 holding members are provided on at least 2 outer edges out of 4 outer edges of each rigid substrate. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010073888(A) 申请公布日期 2010.04.02
申请号 JP20080239654 申请日期 2008.09.18
申请人 RICOH CO LTD 发明人 TADOKORO YOSHIKAZU
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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