| 摘要 |
Etch-resistant solder for attaching leads to semiconductor materials consist of 85 per cent or more of gold, up to 15 per cent of the semiconductor material, and 0.1-1.5 per cent of an impurity element of Group III or V. The semiconductor may be germanium or silicon and the impurity aluminium, gallium, indium, arsenic or antimony. Typical compositions are (1) 87.5-99.9 per cent gold, 0-12 per cent germanium, 0.1-0.5 per cent antimony; and (2) 91-99.9 per cent gold, 0.8 per cent silicon, 0.1-1 per cent antimony. Alloys described for diffusing impurities into silicon transistors are (1) 80 per cent aluminium, 20 per cent gallium; and (2) 95 per cent gold, 5 per cent gallium, aluminium or indium. |
