发明名称 |
METHOD OF MANUFACTURING LENS FOR LIGHT EMITTING DIODE PACKAGE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a lens for a light emitting diode package, which is capable of reducing a manufacture cost through reduction of material loss and improving productivity through a simple process without requiring additional equipment investment by freely materializing a final lens shape by curing liquid resin in multi-steps. <P>SOLUTION: The method of manufacturing a lens for a light emitting diode package includes the steps of: preparing a substrate 110 mounting a light emitting chip 130; forming a temporarily cured resin covering the light emitting chip 130 on the substrate 110; and curing the temporarily cured resin into a shape of a lens 150b. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010056505(A) |
申请公布日期 |
2010.03.11 |
申请号 |
JP20080269086 |
申请日期 |
2008.10.17 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KIM HYUNG TAE;JEON YOUNG RO;LEE OK JU |
分类号 |
H01L33/48;G02B3/00 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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