发明名称 Ballistic-resistant panel including high modulus ultra high molecular weight polyethylene tape
摘要 <p>A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.</p>
申请公布号 AU2008275762(A8) 申请公布日期 2010.03.11
申请号 AU20080275762 申请日期 2008.04.03
申请人 BAE SYSTEMS TENSYLON HIGH PERFORMANCE MATERIALS, INC.;KENNETH HARDING;GENE WEEDON 发明人 KENNETH C. HARDING;GENE C. WEEDON
分类号 B32B5/12 主分类号 B32B5/12
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