| 发明名称 |
Capacitor integration at top-metal level with a protective cladding for copper surface protection |
| 摘要 |
An on-chip decoupling capacitor (106) and method of fabrication. The decoupling capacitor (106) is integrated at the top metal interconnect level (104) and includes surface protection cladding (109) for the copper metal (104b) of the top metal interconnect.
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| 申请公布号 |
US7674682(B2) |
申请公布日期 |
2010.03.09 |
| 申请号 |
US20030697138 |
申请日期 |
2003.10.30 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
BURKE EDMUND;PAPA RAO SATYAVOLU S.;ROST TIMOTHY A. |
| 分类号 |
H01L21/331;H01L21/02;H01L23/522 |
主分类号 |
H01L21/331 |
| 代理机构 |
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