| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein the reduction of height in a semiconductor image sensor is limited by two factors, namely a decrease in red sensitivity in a pixel portion (1) and size (thickness) in an electrical connection means (2). SOLUTION: The semiconductor image sensor includes: a photosensitive region 40 composed on a semiconductor substrate; and a connection region 41 including an electrical connection means to the outside of the semiconductor substrate. In the semiconductor image sensor, a partial thickness of the semiconductor substrate at the connection region is made smaller than that of the semiconductor substrate at the photosensitive region. COPYRIGHT: (C)2010,JPO&INPIT |
